EP-2306 Bonding Adhesive
Adhesive for bonding modeling boards with densities between 0.55-0.72g/cm3. Room temperature curing, can use fast reactive hardener(EH2903) or slower (EH2904).
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Amber Composites Ltd.
Amber Drive | Langley Mill, Nottingham, NG16 4BE, United Kingdom
Tel: +44 (0)1773 530899
Fax: +44 (0)1773 768687
Email: sales@ambercomposites.com
© 2010, Amber Composites Ltd.
Registered in England and Wales No. 2271414
Amber Drive | Langley Mill, Nottingham, NG16 4BE, United Kingdom
Tel: +44 (0)1773 530899
Fax: +44 (0)1773 768687
Email: sales@ambercomposites.com
© 2010, Amber Composites Ltd.
Registered in England and Wales No. 2271414
