Adhesive Films
Adhesive films for a variety of bonding applications. We developed the EF range specifically for bonding honeycomb core to aluminum or fiber-reinforced skins. These films provide excellent adhesive properties over a wide range of core to skin requirements. Curing temperatures from 50°C (122°F) and service temperatures as high as 220°C (428°F).
- EF72 adhesive film is high strength epoxy adhesive formulation supplied in the form of a light weight flexible film. It is intended for metal to metal or sandwich core to skin bonds. Developed alongsi...
- EF44 is a high strength low temperature cure epoxy adhesive formulation supplied in the form of a thin film for general adhesive applications. Developed alongside our range of E600 series.
- EF8020 adhesive film is a high strength epoxy adhesive formulation supplied in the form of a lightweight flexible film. It is intended for metal to metal or sandwich core to skin bonds and has a stro...
- The Redux 200 series is a range of foaming adhesive films presented in sheet form. They expand during the cure cycle to fill gaps and adhere strongly to all parts of the structure with which they come...
- Redux 609 is a curing modified epoxy film adhesive containing cotton scrim for easy handling and glue-line thickness control. It is available at standard areal weights of 300g/m2 and 200g/m2 and is al...
- Redux 312 is a high strength 120°C curing film adhesive, suitable for metal to metal bonding and sandwich constructions, where operating temperature of up to 100°C may be experienced. A supported vers...
- The Redux 319 series consists of film adhesives curing at 175°C. They are available in both supported and unsupported versions at areal weights between 180 and 400g/m. The supported versions contain a...
- Redux 322 is a high performance modified epoxy film adhesive curing at 175°C. It is suitable for bonding metal to metal and for sandwich structures, where operating temperatures are experienced up to ...
