Adhesive Films
Adhesive films for a variety of bonding applications. We developed the EF range specifically for bonding honeycomb core to aluminum or fiber-reinforced skins. These films provide excellent adhesive properties over a wide range of core to skin requirements. Curing temperatures from 50°C (122°F) and service temperatures as high as 126°C (259°F).
- EF72 adhesive film is high strength epoxy adhesive formulation supplied in the form of a light weight flexible film. It is intended for metal to metal or sandwich core to skin bonds. Developed alongsi...
- EF44 is a high strength low temperature cure epoxy adhesive formulation supplied in the form of a thin film for general adhesive applications. Developed alongside our range of E600 series.
- EF8020 adhesive film is a high strength epoxy adhesive formulation supplied in the form of a lightweight flexible film. It is intended for metal to metal or sandwich core to skin bonds and has a stro...
- The Redux 200 series is a range of foaming adhesive films presented in sheet form. They expand during the cure cycle to fill gaps and adhere strongly to all parts of the structure with which they come...
| Adhesive | Weight (gsm per m2) | Min. Cure Temp |
Outlife at amb.Temp |
Characteristics | Tg | Prepreg Co-Cure Compatibility |
|---|---|---|---|---|---|---|
| EF44 | 220 | 50°C (122°F) | 14 Days | Low temperature curing | 126°C (259°F)
(DSC) Following Post-cure @ 140°C (284°F) |
Most low temperature curing prepregs including Amber's E644 & E650 prepregs |
| EF72 | 100 200 300 |
120°C (248°F) | 30 Days | Medium temperature curing | 112°C (234°F)
(DSC) Following 1hr @ 120°C (248°F) |
Most mid temperature curing prepregs including Amber's E722 prepreg |
| EF8020 | 100 200 300 |
70°C (158°F) | 30 Days | Flexible 70-130°C (158- 266°F) low to medium curing | DMTA Onset:
102°C (216°F)
Peak Tan δ:
116°C (241°F) Following 120°C (248°F) |
Designed for use with Amber's 8020 flexible temperature curing prepreg |
